Semiconductor wafer holding method, semiconductor wafer...

Details Semiconductor wafer holding method, semiconductor wafer... Semiconductor wafer holding method, semiconductor wafer...

2011-03-01

2011-03-01

Nguyen, Khanh (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With bending, folding, winding, or wrapping means

C156S446000

Reexamination Certificate

active

07896049

ABSTRACT:
On a back face of a semiconductor wafer, an annular convex portion is formed at an outer periphery so as to surround a flat concave portion formed by back grinding. The back face of the semiconductor wafer is pressed against an adhesive surface of a supporting adhesive tape joined to a ring frame. Thus, the annular convex portion is joined to the adhesive tape. Further, the adhesive tape is deformed while being pressed from a side of its non-adhesive surface. As a result, the adhesive tape is pushed into and joined to the flat concave portion of the back face of the semiconductor wafer.

REFERENCES:
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patent: 5930654 (1999-07-01), Tohyama et al.
patent: 6007654 (1999-12-01), McKenna
patent: 2007/0238264 (2007-10-01), Sekiya
patent: 2003-234392 (2003-08-01), None
patent: 2005135931 (2005-05-01), None

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