Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly semiconductor substrate
Reexamination Certificate
2010-10-13
2011-12-13
Van, Luan (Department: 1724)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly semiconductor substrate
Reexamination Certificate
active
08075756
ABSTRACT:
A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
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Mukaiyama Yoshitaka
Yoshioka Junichiro
Ebara Corporation
Van Luan
Wenderoth , Lind & Ponack, L.L.P.
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