Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2006-04-04
2006-04-04
Phasge, Arun S. (Department: 1753)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S269000, C204S297060, C204S22400M, C204S288300, C118S500000
Reexamination Certificate
active
07022211
ABSTRACT:
A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
REFERENCES:
patent: 5227041 (1993-07-01), Brogden et al.
patent: 5843296 (1998-12-01), Greenspan
patent: 6309520 (2001-10-01), Woodruff et al.
patent: 6-108285 (1994-04-01), None
patent: 11-2000096 (1996-07-01), None
patent: 11-140694 (1999-05-01), None
Journal Ebara, Vol. 181 (Oct. 1998), “Summary of the Plating Apparatus”, pp. 42-49 (with English translation).
Mukaiyama Yoshitaka
Yoshioka Junichiro
Ebara Corporation
Phasge Arun S,.
Wenderoth , Lind & Ponack, L.L.P.
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