Semiconductor wafer heating device

Details Semiconductor wafer heating device Semiconductor wafer heating device

1989-07-03

1991-06-18

Walberg, Teresa J.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

392339, H05B 372

Patent

active

050251333

ABSTRACT:
A semiconductor wafer heating device includes a hollow heating stage. A semiconductor wafer is disposed over one surface of the heating stage and a heater is provided over the other surface thereof. A fluid having an excellent heat conductivity which is filled in the hollow space of the heating stage is stirred uniformly. In consequence, the surface temperature of the heating stage can be made uniform without employing a thick heating stage, and an excellent temperature control of the heating stage can be ensured.

REFERENCES:
patent: 2352899 (1944-07-01), Karlson
patent: 2506886 (1950-05-01), Okulitoh
patent: 2852586 (1958-09-01), Steele
patent: 3452973 (1969-07-01), Kawawa
patent: 3719796 (1973-03-01), Abildtrup
patent: 4778559 (1988-10-01), McNeilly
Kaplan, L. H. et al., "High Uniformity Hot Plate . . . ", IBM Tech. Disc. Bull., vol. 25, No. 9, Feb. 1983, pp. 4750-3.

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