Semiconductor wafer having electrically connected passive...

Details Semiconductor wafer having electrically connected passive... Semiconductor wafer having electrically connected passive...

2005-09-13

2005-09-13

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257S622000

Reexamination Certificate

active

06943430

ABSTRACT:
A semiconductor wafer includes a plurality of passive device units, which are electrically connected across scribe lines. Passive device chips in the wafer that are adjacent to one another in a first direction are electrically connected in parallel, while passive device units adjacent to one another in a second direction are connected in series. By selecting a number of adjacent passive device units extending in the first and second direction, and separating the selected units from the wafer along the corresponding scribe lines, a passive device chip having a desired electrical characteristic (e.g., capacitance or resistance) can be obtained. Such passive device chips may be assembled in a semiconductor package where they are electrically connected to active devices.

REFERENCES:
patent: 5528083 (1996-06-01), Malladi et al.
patent: 5593901 (1997-01-01), Oswald et al.
patent: 11-003969 (1999-01-01), None
patent: 11-260999 (1999-09-01), None
patent: 2001-102512 (2001-04-01), None
patent: 1999-0086685 (1999-12-01), None
patent: 2000-0008455 (2000-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor wafer having electrically connected passive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer having electrically connected passive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer having electrically connected passive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3405701