Semiconductor wafer having an edge based identification feature

Details Semiconductor wafer having an edge based identification feature Semiconductor wafer having an edge based identification feature

2007-03-20

2007-03-20

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

With measuring or testing

C438S016000, C438S401000, C257S618000, C257S620000

Reexamination Certificate

active

10465677

ABSTRACT:
A semiconductor wafer comprises a wafer formed of a semiconductor material having a peripheral edge portion and a repeating mark on the edge portion of the wafer to allow identification of the wafer. Also described is a method of identifying and tracking these semiconductor wafers.

REFERENCES:
patent: 4418467 (1983-12-01), Iwai
patent: 6004405 (1999-12-01), Oishi et al.
patent: 6071059 (2000-06-01), Mages et al.
patent: 6268641 (2001-07-01), Yano et al.
patent: 6420792 (2002-07-01), Guldi et al.
patent: 6482661 (2002-11-01), Madoyski
patent: 6666337 (2003-12-01), Conboy et al.

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