Semiconductor wafer handling method

Details Semiconductor wafer handling method Semiconductor wafer handling method

2005-01-25

2005-01-25

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S113000, C438S464000

Reexamination Certificate

active

06846698

ABSTRACT:
A method of handling a semiconductor wafer from which a plurality of semiconductor devices are to be fabricated during a semiconductor device fabrication process. The method includes the steps of attaching a flexible connected layer to a semiconductor wafer layer mounted on a carrier substrate and separating the wafer layer from the carrier substrate while supported by the flexible connected layer.

REFERENCES:
patent: 6555443 (2003-04-01), Artmann et al.
patent: 6667192 (2003-12-01), Patrice et al.
patent: 20010018229 (2001-08-01), Kato et al.

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