Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...
Reexamination Certificate
2011-03-29
2011-03-29
Culbert, Roberts (Department: 1716)
Etching a substrate: processes
Nongaseous phase etching of substrate
Using film of etchant between a stationary surface and a...
C438S692000
Reexamination Certificate
active
07914694
ABSTRACT:
A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
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Schutte Christopher L.
Wallace George T.
Brady III Wade J.
Culbert Roberts
Garner Jacqueline J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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