Semiconductor wafer grinding method

Details Semiconductor wafer grinding method Semiconductor wafer grinding method

2005-11-29

2005-11-29

Rose, Robert A. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000

Reexamination Certificate

active

06969302

ABSTRACT:
To reduce the wafer production cost by grinding a sliced semiconductor wafer at a high accuracy and a high efficiency and supplying the wafer to the next polishing step. A semiconductor wafer is rough ground between grindstones by a fixed grindstone. After rough grinding, finish grinding by free abrasive grain is performed on the same grinding axis by supplying a slurry which suspends fine abrasive grain between the grindstones through slurry pipes. To perform finish grinding by free abrasive grains, a rotational speed and a feed rate of the grindstones are lowered to lower the grinding action by a fixed grindstone.

REFERENCES:
patent: 5827779 (1998-10-01), Masumura et al.
patent: 5882539 (1999-03-01), Hasegawa et al.
patent: 5897426 (1999-04-01), Somekh
patent: 5942445 (1999-08-01), Kato et al.
patent: 6022264 (2000-02-01), Cook et al.
patent: 6039631 (2000-03-01), Sato et al.
patent: 0745456 (1996-12-01), None

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