Semiconductor wafer grinding apparatus

Details Semiconductor wafer grinding apparatus Semiconductor wafer grinding apparatus

1999-06-18

2000-12-12

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 24, B24B 4908

Patent

active

061590711

ABSTRACT:
Disclosed is an improved semiconductor wafer grinding apparatus comprising at least wafer holding means and wafer grinding means. The wafer holding means comprises a holder having a wafer-gripping surface for sucking and holding a selected semiconductor wafer and liquid bearing means for rotatably supporting the holder. The liquid bearing means has inclination control means formed therein, and the inclination control means includes discrete inclination controlling areas for suspending the holder at upper and lower levels. Each inclination controlling area has flow rate control means connected thereto. The parallelism of the wafer-gripping surface relative to the wafer grinding means is assured by controlling the flow rate of the liquid to each inclination controlling area.

REFERENCES:
patent: 3872626 (1975-03-01), White
patent: 5567199 (1996-10-01), Huber et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5816895 (1998-10-01), Honda
patent: 5916016 (1999-06-01), Bothra
patent: 5944580 (1999-08-01), Kim et al.

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