Semiconductor wafer grinder

Details Semiconductor wafer grinder Semiconductor wafer grinder

2007-01-16

2007-01-16

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S288000, C451S388000, C451S443000

Reexamination Certificate

active

11325737

ABSTRACT:
A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat surface on the wafer. The index table includes a wafer holder for receiving and holding the wafer. A dressing station, including a dressing element, is positioned adjacent to the index table for dressing the grinding wheel. The dressing station is rotatable between a first position and a second position where the grinding wheel is dressed by the dressing element.

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G&N, Fully Automatic Material Grinding with Nanogrinder/4-300, catalog, unknown date, 4 pgs., printed in Germany.
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G&N, Precision. Economy. Reliability. The G&N Machine Program for semiconductor Production and Other Advanced Materials, unknown date, 16 pgs., printed in Germany.

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