Semiconductor wafer grinder

Abrading – Precision device or process - or with condition responsive... – With feeding of tool or work holder

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S288000, C451S388000, C451S443000

Reexamination Certificate

active

07011567

ABSTRACT:
A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat surface on the wafer. The index table includes a wafer holder for receiving and holding the wafer and a dressing element for dressing the grinding wheel. The index table is selectively rotatable between a grinding position where the wafer is ground by the grinding wheel and a dressing position where the grinding wheel is dressed by the dressing element.

REFERENCES:
patent: 4583325 (1986-04-01), Tabuchi
patent: 4947598 (1990-08-01), Sekiya
patent: 5679060 (1997-10-01), Leonard et al.
patent: 5791976 (1998-08-01), Honda
patent: 5827112 (1998-10-01), Ball
patent: 6062954 (2000-05-01), Izumi
patent: 6159071 (2000-12-01), Koma et al.
patent: 6168499 (2001-01-01), Jang
patent: 6168683 (2001-01-01), Cesna
patent: 6332833 (2001-12-01), Ohshima et al.
patent: 6431949 (2002-08-01), Ishikawa et al.
patent: 6431964 (2002-08-01), Ishikawa et al.
patent: 6443818 (2002-09-01), Bent
patent: 6527627 (2003-03-01), Arai
patent: 6685542 (2004-02-01), Mori et al.
patent: 2002/0086623 (2002-07-01), Togawa et al.
patent: 2002/0160691 (2002-10-01), Ishikawa et al.
patent: 2003/0232581 (2003-12-01), Ki
G&N, Fully Automatic Mater Grinding with the Nanogrinder/4-300, catalog, unknown date, 4 pgs., printed in Germany.
G&N, Fully Automatic Wafer Grinder Multi-Nono/3-300, catalog, unknown date, 4 pgs., printed in Germany.
G&N, Precision. Economy. Reliability. The G&N Machine Program for semiconductor Production and Other Advanced Materials, unknown date, 16 pgs., printed in Germany.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor wafer grinder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer grinder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer grinder will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3584011

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.