Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1994-01-04
1997-01-21
Rachuba, Maurina T.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 8, 451 43, 1566541, 414222, B24B 4900
Patent
active
055955223
ABSTRACT:
An edge polishing system (20, 320) and method for edge polishing semiconductor wafers is disclosed. The system (20, 320) includes a loader (22, 326), a polisher (24, 328), an unloader (26, 330), and a controller (28, 335). The method includes the steps of loading wafers (28), and spacers (30) into a loader (22) to form a stack (36), moving the stack (36) into a polisher (24) and causing polisher (24) to polish the stack (36), then moving the stack (36) to an unloader (26), which semiautomatically removes the wafers (28) and spacers (30). The system (20) may include a controller (28) for entering the appropriate commands.
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FAM Speedfam Corporation, Electronics Equipment Group, A Subsidiary of FAMTEC International, Inc.
Bilderback Douglas W.
Clark Arthur R.
Dyer Lawrence D.
Gullett Tom G.
King Clyde A.
Brady III W. James
Donaldson Richard L.
Rachuba Maurina T.
Swayze, Jr. W. Daniel
Texas Instruments Incorporated
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