Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1998-02-12
1999-08-10
Scherbel, David A.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 8, 451 9, 451 25, B24B 4900, B24B 5100
Patent
active
059349735
ABSTRACT:
A semiconductor wafer dicing saw is controlled by monitoring blade exposure from a flange holding the blade during the wafer dicing process. As the wafer is cut and separated into discrete electronic chips, the dicing blade wears. As the blade is brought closer and closer toward the wafer during cutting, the blade exposure is continuously being reduced. The small dimensions, coolant flow, and close tolerances typical in the wafer dicing process, do not permit visual inspection. Excess blade wear and thus reduced exposure or flange clearance between the blade cutting edge and flange edge will cause damage to the wafer and blade by restricting coolant flow or by contact of the flange with the wafer. A system is provided for automatically measuring the flange clearance using a height sensor to determine blade wear and a processor for monitoring blade movement toward the wafer during the wafer dicing and stopping the movement when the blade cutting edge reaches a minimum separation distance from the work surface or a minimum blade exposure is reached. A blade history is stored that provide a number of cuts make through the wafer for a given wear.
REFERENCES:
patent: 2578869 (1951-12-01), Washburn
patent: 2583791 (1952-01-01), Neff
patent: 3626921 (1971-12-01), Lane
patent: 3645002 (1972-02-01), Hefti
patent: 3763698 (1973-10-01), Suzuki et al.
patent: 3803906 (1974-04-01), Ross
patent: 3987670 (1976-10-01), Tuzzeo et al.
patent: 4180048 (1979-12-01), Regan
patent: 4219004 (1980-08-01), Runyon
patent: 4787362 (1988-11-01), Boucher et al.
patent: 5718615 (1998-02-01), Boucher et al.
Bajune David E.
Boucher John N.
Banks Derrie Holt
Scherbel David A.
LandOfFree
Semiconductor wafer dicing saw does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor wafer dicing saw, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer dicing saw will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1113875