Semiconductor wafer dicing machine

Details Semiconductor wafer dicing machine Semiconductor wafer dicing machine

1985-12-27

1987-08-25

Whitehead, Harold D.

Stone working

Sawing

Rotary

B28D 104

Patent

active

046885404

ABSTRACT:
A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station, at least one alignment station, a cutting means disposed in the cutting station, a detecting means disposed in the alignment station for detecting the cutting lines of the wafer, and a wafer transferring means. The wafer transferring means includes two wafer supporting means and the dicing machine is capable of positioning one of the two wafer supporting means in the alignment station and performing alignment of a semiconductor wafer supported with said one of the wafer supporting means while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means. The cutting means includes two cutting blades and a cutting blade interval setting-up means for setting up the interval of these cutting blades.

REFERENCES:
patent: 2187299 (1940-01-01), Burkhardt
patent: 3081586 (1963-03-01), Gersbach
patent: 3289662 (1966-12-01), Garrison
patent: 4328553 (1982-05-01), Fredriksen
patent: 4407262 (1983-10-01), Wirz

Affiliated with

Also associated with

Rating

Semiconductor wafer dicing machine does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer dicing machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer dicing machine will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1917453