Semiconductor wafer corrosion protection solution

Details Semiconductor wafer corrosion protection solution Semiconductor wafer corrosion protection solution

1975-02-03

1976-06-15

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Corrosion inhibiting coating composition

106 1, 2521816, 252387, 252514, 252518, C09D 508

Patent

active

039635007

ABSTRACT:
A composition for the corrosion protection of a metallized semiconductor die or wafer containing an alcohol solution of boron, phosphorous and a metal selected from the group consisting of gold, palladium, rhodium and platinum. The solution is prepared by mixing phosphorous pentoxide in an alcohol solvent. The dissolution of the phosphorous pentoxide is exothermic and the temperature of the solution will rise during the reaction. Then boric anhydride and a salt or oxide of gold, palladium, rhodium or platinum are added to the solution.

REFERENCES:
patent: 3617320 (1971-11-01), Lee

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