Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Reexamination Certificate
1999-03-26
2001-07-03
El-Arini, Zeinab (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
C134S002000, C134S003000, C134S018000, C134S021000, C134S153000, C134S902000, C015S077000, C015S088200
Reexamination Certificate
active
06254690
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a device for cleaning a semiconductor wafer in the overall semiconductor process, and a method of cleaning the semiconductor wafer, using the device.
2. Description of the Related Art
As a device for and a method of cleaning a semiconductor wafer, a device for and a method of cleaning both surfaces of a semiconductor wafer have been proposed as disclosed in Japanese Patent Application Laid-Open. Nos. Hei 1-184831, 4-94537, 5-3184, 7-169732 and 8-71519.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a semiconductor wafer cleaning device capable of accurately holding even a large-diameter semiconductor wafer in a horizontal state and reliably effecting a process such as cleaning or the like thereon, and a semiconductor wafer cleaning method using the semiconductor wafer cleaning device.
According to one aspect of this invention, for achieving the above object, there is provided a semiconductor wafer cleaning device, comprising:
first cleaning means for holding a semiconductor wafer in a horizontal state and contacting the entire lower surface of the semiconductor wafer; and
second cleaning means for cleaning an upper surface of the semiconductor wafer.
According to another aspect of this invention, there is provided a method of cleaning a semiconductor wafer, comprising the following step:
a step for supporting the semiconductor wafer from a lower surface thereof so as to keep the same in a horizontal state and cleaning the lower surface of the semiconductor wafer and an upper surface thereof while the semiconductor wafer is being kept in the horizontal state.
Typical ones of various inventions of the present application have been shown in brief. However, the various inventions of the present application and specific configurations of these inventions will be understood from the following description.
REFERENCES:
patent: 5651160 (1997-07-01), Yonemizu et al.
patent: 5860178 (1999-01-01), Nishimura et al.
patent: 5882426 (1999-03-01), Yonemizu et al.
patent: 5927305 (1999-07-01), Shiba
patent: 5964954 (1999-10-01), Matsukawa et al.
patent: 1-184831 (1989-07-01), None
patent: 4-94537 (1992-03-01), None
patent: 5-3184 (1993-01-01), None
patent: 7-169732 (1995-07-01), None
patent: 8-71519 (1996-03-01), None
El-Arini Zeinab
OKI Electric Industry Co., Ltd.
Rabin & Champagne, P.C.
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