Semiconductor wafer clamp device and method

Details Semiconductor wafer clamp device and method Semiconductor wafer clamp device and method

1995-05-23

1998-03-31

Breneman, R. Bruce

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118728, 118500, 118503, 156345, 269 97, 269254R, 269254CS, 269289R, 269317, 269903, C23C 1450, B05C 1302

Patent

active

057334269

ABSTRACT:
Semiconductor wafer clamp device includes at least one clamp apparatus, the clamp apparatus including a removable clamp finger coupled to a connecting block by a connector. The device allows access to clamp apparatus from a top surface of a substrate holder, eliminating the need to remove the substrate holder in order to perform maintenance or repair operations on clamp apparatus. Tempered springs in the clamp apparatus reduce resilience losses experienced with non-tempered springs. Plastic clamp shaft bushings and spring retainers extend the useful life of clamp apparatus components by eliminating wear caused by metal-to-metal contact of moving parts.

REFERENCES:
patent: 4522697 (1985-06-01), Dimock et al.
patent: 5478399 (1995-12-01), Willard
Figures 1,2,3 and description on pp. 3-6 of patent application.
Figure 1 and accompanying description on pp. 3-4 of patent application.
Figure 2 and accompanying description on p. 4 of patent application.
Figure 3 and accompanying description on pp. 4-6 of patent application.

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