Semiconductor wafer chuck with built-in standoff for contactless

Details Semiconductor wafer chuck with built-in standoff for contactless Semiconductor wafer chuck with built-in standoff for contactless

1975-04-16

1977-02-08

Weidenfeld, Gil

Chucks or sockets

Vacuum

156285, B23B 3100

Patent

active

040069095

ABSTRACT:
A semiconductor wafer vacuum chuck used as part of a photographic wafer-alignment machine for performing contactless photolithography has integral spacer means disposed on a substantially planar surface thereof for mechanically maintaining a fixed distance between portions of a wafer positioned adjacent the spacer means and the surface of the wafer chuck, whereby a controlled separation is provided between a surface of the wafer and a photographic mask overlying the surface of the wafer upon the application of a vacuum to the surface of the wafer chuck.

REFERENCES:
patent: 2366935 (1945-01-01), Schmid
patent: 2955829 (1960-10-01), Brewster
Vonkanel, W., IBM Technical Disclosure Bulletin, p. 61, vol. 6, No. 7, Dec. 1963.

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