Semiconductor wafer breaking apparatus

Details Semiconductor wafer breaking apparatus Semiconductor wafer breaking apparatus

1986-10-02

1988-10-04

Kazenske, E. R.

Severing by tearing or breaking

Breaking or tearing apparatus

Movable breaking tool

225 93, 225103, B26F 300

Patent

active

047750855

ABSTRACT:
A semi-full cut semiconductor wafer is put on an adhesive sheet attached to a ring frame. Then, the semiconductor wafer is pushed upward from the back surface of the adhesive sheet by a rotatable breaking member in the shape of a disk the edge portion of which is triangular in section. In this state, the ring frame is moved so that the breaking member may not deviate from dicing lines, whereby the semiconductor wafer is divided into a large number of chips.

REFERENCES:
patent: 3206088 (1965-09-01), Meyer et al.
patent: 3497948 (1970-03-01), Wiesler et al.
patent: 3562803 (1971-02-01), Townsend
patent: 4005808 (1977-02-01), Insolio
patent: 4195758 (1980-04-01), Morgan

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