Semiconductor wafer baking apparatus

Details Semiconductor wafer baking apparatus Semiconductor wafer baking apparatus

2005-12-28

2008-05-27

Wilson, Gregory (Department: 3749)

Heating

Accessory means for holding, shielding or supporting work...

Support structure for heat treating ceramics

C219S443100, C118S725000

Reexamination Certificate

active

07377776

ABSTRACT:
A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

REFERENCES:
patent: 5588827 (1996-12-01), Muka
patent: 6416318 (2002-07-01), Lee et al.
patent: 6590186 (2003-07-01), Tanaka et al.
patent: 6884066 (2005-04-01), Nguyen et al.
patent: 6921436 (2005-07-01), Ueda
patent: 7156924 (2007-01-01), Renken

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