Semiconductor wafer assemblies comprising photoresist over...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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C257S632000, C257S635000, C257S637000, C257S639000, C438S725000, C438S757000, C438S763000, C438S769000, C438S786000, C438S787000, C438S791000

Reexamination Certificate

active

07057263

ABSTRACT:
In one aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) forming a photoresist over and against the barrier layer. In another aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; c) forming a photoresist over and against the barrier layer; d) exposing the photoresist to a patterned beam of light to render at least one portion of the photoresist more soluble in a solvent than an other portion, the barrier layer being an antireflective surface that absorbs light passing through the photoresist; and e) exposing the photoresist to the solvent to remove the at least one portion while leaving the other portion over the barrier layer. In yet another aspect, the invention includes a semiconductor wafer assembly, comprising: a) a silicon nitride material, the material having a surface; b) a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) a photoresist over and against the barrier layer.

REFERENCES:
patent: 3549411 (1970-12-01), Bean
patent: 3649884 (1972-03-01), Haneta
patent: 3884698 (1975-05-01), Kakihama et al.
patent: 4075367 (1978-02-01), Gulett
patent: 4330569 (1982-05-01), Gulett et al.
patent: 4439270 (1984-03-01), Powell et al.
patent: 4446194 (1984-05-01), Candelaria
patent: 4485553 (1984-12-01), Christian
patent: 4499656 (1985-02-01), Fabian et al.
patent: 4543707 (1985-10-01), Ito et al.
patent: 4612629 (1986-09-01), Harari
patent: 4695872 (1987-09-01), Chatterjee
patent: 4698787 (1987-10-01), Mukherjee et al.
patent: 4732858 (1988-03-01), Brewer et al.
patent: 4868632 (1989-09-01), Hayashi et al.
patent: 4874716 (1989-10-01), Rao
patent: 4939559 (1990-07-01), DiMaria et al.
patent: 4996081 (1991-02-01), Ellul et al.
patent: 5041888 (1991-08-01), Possin et al.
patent: 5045345 (1991-09-01), Singer
patent: 5045847 (1991-09-01), Tarui et al.
patent: 5098865 (1992-03-01), Machado et al.
patent: 5160998 (1992-11-01), Itoh et al.
patent: 5178016 (1993-01-01), Dauenhauer et al.
patent: 5219788 (1993-06-01), Abernathey et al.
patent: 5304829 (1994-04-01), Mori et al.
patent: 5306946 (1994-04-01), Yamamoto
patent: 5442223 (1995-08-01), Fujii
patent: 5489542 (1996-02-01), Iwai et al.
patent: 5518946 (1996-05-01), Kuroda
patent: 5523616 (1996-06-01), Den
patent: 5554418 (1996-09-01), Ito et al.
patent: 5587344 (1996-12-01), Ishikawa
patent: 5756404 (1998-05-01), Friedenreich et al.
patent: 5773325 (1998-06-01), Teramoto
patent: 5795821 (1998-08-01), Bacchetta et al.
patent: 5831321 (1998-11-01), Nagayama
patent: 5834374 (1998-11-01), Cabral, Jr. et al.
patent: 5877069 (1999-03-01), Robinson
patent: 5882978 (1999-03-01), Srinivasan et al.
patent: 5891793 (1999-04-01), Gardner et al.
patent: 5904523 (1999-05-01), Feldman et al.
patent: 5918147 (1999-06-01), Filipiak et al.
patent: 5925494 (1999-07-01), Horn
patent: 5926739 (1999-07-01), Rolfson et al.
patent: 5985771 (1999-11-01), Moore et al.
patent: 6033971 (2000-03-01), Motonami et al.
patent: 6093956 (2000-07-01), Moore et al.
patent: 6103619 (2000-08-01), Lai
patent: 6140181 (2000-10-01), Forbes et al.
patent: 6143627 (2000-11-01), Robinson
patent: 6143662 (2000-11-01), Rhodes et al.
patent: 6265241 (2001-07-01), Pan
patent: 6300253 (2001-10-01), Moore et al.
patent: 6380611 (2002-04-01), Yin et al.
patent: 6417559 (2002-07-01), Moore et al.
patent: 6420777 (2002-07-01), Lam et al.
patent: 6670695 (2003-12-01), Gau et al.
patent: 6693345 (2004-02-01), Moore et al.
patent: 6756634 (2004-06-01), Helm et al.
patent: 2129217 (1984-05-01), None
patent: 2145243 (1985-03-01), None
patent: 2170649 (1986-08-01), None
patent: 362137854 (1987-06-01), None
patent: 401086562 (1989-03-01), None
patent: 403075158 (1991-03-01), None
patent: 09055351 (1997-02-01), None
Silicon Proc. for VLSI; 177-178; vol. 1; S. Wolf.
Silicon Proc. for VLSI; 191-193; vol. 1; S. Wolf.
Silicon Proc. for VLSI; 37-38; 598-599; vol. 2; S. Wolf.
Electronic Materials Science For Integrated Circuits; 1990 ©; Mayer et al; pp. 269-274; Pub. 1990.
Intrinsic Stress in Silicon Nitride and Silicon Dioxide Films Prepared by Various Deposition Techniques; 1988 IEEE Internatl. Sympos. On Electrical Insulation, Boston, MA; Jun. 5-8, 1988; 1 page; Kanicki, J. et al.
Passivation of GaAsFET's with PECVD Silicon Nitride Films of Different Stress States: IEEE Transactions on Electron Devices; vol. 35, No. 9; Sep. 1988; pp. 1412-1418.
Silicon Nitride Overcoats for Thin Film Magnetic Recording Media; IEEE Transactions on Magnetics; vol. 27, No. 26, Nov. 1991; pp. 5070-5072.

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