Patent
1987-10-28
1990-09-04
Mintel, William
357 81, 357 68, 357 55, 357 76, H01L 2316
Patent
active
049548751
ABSTRACT:
A semiconductor wafer array comprising a plurality of wafers of semiconductor material. Each of the wafers is provided with cone-shaped or pyramid-shaped vias. Inserted in each of the vias is a correspondingly shaped wad of electrically conductive compliant material for forming continuous vertical electrical connections between the wafers in the stack. The base of each wad makes connection to a bonding pad on the surface of a lower wafer as well as to the electrically conductive compliant material in the lower wafer.
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Laser Dynamics Inc.
Mintel William
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