Semiconductor wafer and semiconductor device provided with...

Details Semiconductor wafer and semiconductor device provided with... Semiconductor wafer and semiconductor device provided with...

2007-05-22

2007-05-22

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Direct application of electrical current

C438S614000, C438S652000, C438S674000, C257SE23012

Reexamination Certificate

active

10323645

ABSTRACT:
A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The semiconductor wafer can be preferably used for producing a chip-sized semiconductor device provided with columnar electrodes to which an external connection terminal, such as a solder ball, is to be bonded. Methods of producing the semiconductor wafer and device by use of plating are also disclosed.

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Hou M.M.: “Super CSP: The Wafer Level Package” Jul. 1998, pp. F-01-F10.

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