Semiconductor wafer and manufacturing method therefor

Details Semiconductor wafer and manufacturing method therefor Semiconductor wafer and manufacturing method therefor

1991-08-05

1993-07-06

Robinson, Ellis P.

Stock material or miscellaneous articles

Circular sheet or circular blank

Recording medium or carrier

428 66, 428192, 428212, 428216, 428446, 428698, 428699, 428704, 148 333, 148DIG161, 437 95, 437238, 437946, 437947, B32B 1302

Patent

active

052252353

ABSTRACT:
A semiconductor wafer on which silicon or the like is epitaxially grown and p-type or n-type impurities are doped and which has at the rear surface except for the peripheral edge portion thereof a blocking film for preventing jumping out of impurities therefrom which causes auto-doping, thereby preventing silicon particles from being produced at the peripheral surface and preventing the semiconductor wafer from being contaminated by the silicon particles during the manufacturing a semiconductor device.

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G. Janus, "Semiconductor Silicon Manufacturing and Machining Using Diamond Tools".

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