Semiconductor device manufacturing: process – Semiconductor substrate dicing
Patent
1998-09-17
2000-12-12
Monin, Jr., Donald L.
Semiconductor device manufacturing: process
Semiconductor substrate dicing
438 15, 438462, H01L 2348
Patent
active
061598267
ABSTRACT:
The present invention relates to a semiconductor device, and more particularly to a structure of a semiconductor wafer and a fabrication method of semiconductor chips. According to the present invention, a semiconductor wafer containing a plurality of semiconductor chip portions has a plurality of chip scribe lanes formed between the semiconductor chip portions. A plurality of chip bonding pads are formed on the semiconductor chip portions of the wafer, and a plurality of wafer probing pads are formed on the chip scribe lanes. The wafer probing pads are electrically connected to internal circuits of the semiconductor chip portions and/or to corresponding ones of the chip bonding pads.
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Kim Jae Woon
Park Jong Hoon
Dietrich Mike
Hyundai Electronics Industries Co,. Ltd.
Monin, Jr. Donald L.
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