Semiconductor wafer and die handling method and means

Details Semiconductor wafer and die handling method and means Semiconductor wafer and die handling method and means

1980-07-14

1983-07-26

Thibodeau, Paul J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

248346, 428156, 428172, 428447, B32B 326, B32B 2520

Patent

active

043954510

ABSTRACT:
Semiconductor wafer and die handling method and means are disclosed which include use of a rigid substrate and attached compliant elastomer layer. The outer face of the elastomer layer is texturized to reduce the interfacial forces between said layer and semiconductors supported thereon sufficiently to allow for removal of the semiconductors by conventional means. Friction forces between the texturized layer and semiconductors and remaining interfacial forces are sufficiently high to prevent undesired movement of semiconductors relative to the supporting layer during handling. The elastomer layer may be bonded to the substrate, or attached thereto by interfacial forces between smooth abutting substrate and elastomer layer surfaces. Among other things, the compliant elastomer layer may be included in the construction of a shipping container for semiconductor chips, wafers, or the like. Texturization of the elastomer surface may be provided by molding using a mold with a texturized surface.

REFERENCES:
patent: 2079273 (1937-05-01), Angier
patent: 2572470 (1951-10-01), Gordon
patent: 2669535 (1954-02-01), Orr
patent: 2768902 (1950-10-01), Scholl
patent: 4068030 (1978-01-01), Witman

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