Semiconductor wafer and a method for manufacturing a...

Details Semiconductor wafer and a method for manufacturing a... Semiconductor wafer and a method for manufacturing a...

2007-09-11

2007-09-11

Sarkar, Asok Kumar (Department: 2891)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

C438S462000

Reexamination Certificate

active

11077039

ABSTRACT:
A semiconductor wafer includes (a) a first principal side and a second principal side opposite to each other, (b) a first bevel contour and a second bevel contour provided at an outer periphery of the first principal side and the second principal side, (c) a first recess formed in the first bevel contour, and (d) a first type of ID mark configured by a protruding dot provided on a bottom face of the first recess.

REFERENCES:
patent: 6004405 (1999-12-01), Oishi et al.
patent: 2001/0038153 (2001-11-01), Sakaguchi
patent: 2003/0003608 (2003-01-01), Arikado et al.
patent: 58-207621 (1983-12-01), None
patent: 9-063938 (1997-03-01), None
patent: 10-256105 (1998-09-01), None
patent: 2000-223380 (2000-08-01), None
patent: 2000-223382 (2000-08-01), None
patent: 2001-101337 (2001-04-01), None
patent: 2001-118757 (2001-04-01), None
patent: 2001-351835 (2001-12-01), None
patent: 2002-353080 (2002-12-01), None

Affiliated with

Also associated with

Rating

Semiconductor wafer and a method for manufacturing a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer and a method for manufacturing a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer and a method for manufacturing a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3801721