Semiconductor wafer alignment apparatus

Details Semiconductor wafer alignment apparatus Semiconductor wafer alignment apparatus

1974-11-25

1977-09-06

Reynolds, Bruce A.

Electric heating

Metal heating

By arc

29 566, 83 6, 225 2, B23K 2600

Patent

active

040469859

ABSTRACT:
An apparatus for treating a wafer of semiconductor material so that individual devices which may be simple devices or complete complex integrated circuits defined on the front surface of the wafer can be easily separated from the wafer. The apparatus aligns the wafer to a fixed reference position, inverts the aligned wafer to expose its backside and transfers it with controlled motion to a set position under a laser beam apparatus. The laser beam scans the backside of the wafer to create in the kerf area between each of the devices an easily fractured region. While maintaining the wafer alignment the laser treated wafer may be transferred to a flexible pressure sensitive tape tensioned across the frame which maintains the wafer alignment. The wafer, while on the frame can be tested, fractured into respective individual devices, and selectively removed from the tape.

REFERENCES:
patent: 3165818 (1965-01-01), Soffa et al.
patent: 3626141 (1971-12-01), Daly
patent: 3811182 (1974-05-01), Ryan, Sr. et al.
patent: 3816700 (1974-06-01), Weiner et al.
patent: 3824678 (1974-07-01), Harris et al.
patent: 3851758 (1974-12-01), Makhijani et al.

Affiliated with

Also associated with

Rating

Semiconductor wafer alignment apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer alignment apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer alignment apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2164138