Semiconductor wafer

Stock material or miscellaneous articles – Structurally defined web or sheet – Including variation in thickness

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Details

357 40, 427 82, 427 93, 427272, 428447, 428901, 430 5, B32B 300, B32B 904

Patent

active

044105800

ABSTRACT:
A semiconductor wafer is provided having a plurality of projections along the dicing lines of the wafer surrounding each area on which an integrated circuit is formed, the projections being spaced apart.

REFERENCES:
patent: 3442011 (1969-05-01), Strieter
patent: 3453723 (1969-07-01), Cecil
patent: 3476617 (1969-11-01), Robinson
patent: 3502515 (1970-03-01), McMullin et al.
patent: 3578515 (1971-05-01), Borrello et al.

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