Semiconductor wafer

Details Semiconductor wafer Semiconductor wafer

1988-05-23

1991-03-26

Hille, Rolf

357 52, 357 53, 357 85, H01L 2940, H01L 2960, H01L 4900

Patent

active

050033743

ABSTRACT:
A method and semiconductor devices and wafers produced therefrom are provided which comprise at least one scribe lane formed in at least a peripheral edge, a metal film covering at least a portion of said scribe lane and having metal limiting means so preselectively spaced and configured that scribing the wafer in any direction along said portion of the scribe lane containing metal limiting means will result in a bent metal portion within the range of about 0 to 10 microns.

REFERENCES:
patent: 4503597 (1985-03-01), Kushima et al.
patent: 4835592 (1989-05-01), Zommer

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