Semiconductor unit with connecting wires

Details Semiconductor unit with connecting wires Semiconductor unit with connecting wires

1980-07-11

1983-04-19

James, Andrew J.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 65, 428607, 428620, 29591, H01L 2348, H01L 2946, H01L 2962

Patent

active

043807755

ABSTRACT:
To reduce failure and breakage of connecting wires connecting specific zones on semiconductor chips to semiconductor frames, the connecting wires are made of an aluminum-copper alloy having, by weight, 3 to 5%, preferably 4% copper, the remainder aluminum (neglecting incidental impurities), the diameter of the wires being between about 0.01 to 0.06 mm, preferably about 0.02 to 0.05 mm, connected to the frame and the semiconductor, respectively, by ultrasonic bonding.

REFERENCES:
patent: 3274667 (1966-09-01), Siebertz
patent: 3743894 (1973-07-01), Hall et al.
patent: 4027236 (1977-05-01), Kummer et al.
patent: 4355082 (1982-10-01), Bischoff et al.
Metals in the Service of Man, p. 79, Seventh Edition, 1980.
Aluminum-Taschenbuch (Aluminum Handbook) 13, Edition, 1974, p. 901.
IBM Technical Disclosure Bulletin, Aluminum Land Metallurgy with Copper on the Surface, by Daley et al., vol. 13, No. 6, Nov. 1970.

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