Semiconductor unit and method for manufacturing the same

Details Semiconductor unit and method for manufacturing the same Semiconductor unit and method for manufacturing the same

1997-10-03

2000-08-15

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438118, 438119, 438613, 438614, H01L 2144

Patent

active

061035513

ABSTRACT:
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.

REFERENCES:
patent: 3893156 (1975-07-01), Riseman
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5336547 (1994-08-01), Kawakita et al.
patent: 5436503 (1995-07-01), Kunitomo et al.
patent: 5578527 (1996-11-01), Chang et al.
patent: 5611884 (1997-03-01), Bearinger et al.
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5734199 (1998-03-01), Kawakita et al.
patent: 5796591 (1998-08-01), Dalal et al.
patent: 5801446 (1998-09-01), DiStefano et al.
patent: 5808319 (1998-09-01), Gardner et al.
patent: 5808878 (1998-09-01), Saito et al.
patent: 5844320 (1998-12-01), Ono et al.
patent: 5907187 (1999-05-01), Koiwa et al.
patent: 5912505 (1999-06-01), Itoh et al.
patent: 5914536 (1999-06-01), Shizuki et al.
Jul. 28, 1999, Communication from EPO and attached Search Report.
Jan. 15, 1980, "IC KA JISSOU GIJUTSU", edited by Japan Microelectronics Association, published by Institute for Industrial Research, pp. 80-85. (with English abstract).

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