Semiconductor texturing process

Details Semiconductor texturing process Semiconductor texturing process

2002-11-29

2010-11-09

Ahmed, Shamim (Department: 1792)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C216S067000, C216S079000, C216S083000, C438S710000, C438S719000, C438S745000, C438S753000

Reexamination Certificate

active

07828983

ABSTRACT:
The invention provides a process for texturing a surface of a semiconductor material, the process comprising: applying a layer of a protective substance on said surface wherein said layer is sufficiently thin that it has a plurality of apertures therethrough; and contacting said layer and said semiconductor material with an etchant capable of etching said semiconductor material faster than said protective substance, said etchant making contact with said semiconductor material at least through said apertures, for a time and under conditions in which said semiconductor material is etched by said etchant in the vicinity of said apertures to produce a textured surface on said semiconductor material, but said protective substance is substantially unetched.

REFERENCES:
patent: 3278811 (1966-10-01), Mori et al.
patent: 3422527 (1969-01-01), Gault
patent: 3647581 (1972-03-01), Mash
patent: 3690953 (1972-09-01), Wise
patent: 3985579 (1976-10-01), Rahilly
patent: 4038104 (1977-07-01), Tsutomu
patent: 4082570 (1978-04-01), House et al.
patent: 4110122 (1978-08-01), Kaplow et al.
patent: 4153476 (1979-05-01), Frosh et al.
patent: 4278473 (1981-07-01), Borden
patent: 4332973 (1982-06-01), Sater
patent: 4406913 (1983-09-01), Weyrich
patent: 4409422 (1983-10-01), Sater
patent: 4409423 (1983-10-01), Holt et al.
patent: 4444992 (1984-04-01), Cox, III et al.
patent: 4516314 (1985-05-01), Sater
patent: 4527183 (1985-07-01), Anthony et al.
patent: 4554727 (1985-11-01), Deckman
patent: 4626613 (1986-12-01), Wenham et al.
patent: 4633031 (1986-12-01), Todorof et al.
patent: 4686321 (1987-08-01), Kishi
patent: 4692782 (1987-09-01), Seki et al.
patent: 4805006 (1989-02-01), Yamaguchi et al.
patent: 4883561 (1989-11-01), Gmitter et al.
patent: 4892592 (1990-01-01), Dickson et al.
patent: 4982099 (1991-01-01), Lischke
patent: 4989059 (1991-01-01), Micheels et al.
patent: 5011544 (1991-04-01), Gaddy et al.
patent: 5016073 (1991-05-01), Elliott et al.
patent: 5067985 (1991-11-01), Carver et al.
patent: 5073230 (1991-12-01), Maracas et al.
patent: 5081049 (1992-01-01), Green et al.
patent: 5082791 (1992-01-01), Micheels et al.
patent: 5098482 (1992-03-01), Warfield
patent: 5116464 (1992-05-01), Edell et al.
patent: 5136346 (1992-08-01), Kornowski
patent: 5139974 (1992-08-01), Sandhu et al.
patent: 5149676 (1992-09-01), Kim et al.
patent: 5266125 (1993-11-01), Rand et al.
patent: 5279703 (1994-01-01), Haberger et al.
patent: 5306647 (1994-04-01), Lehmann et al.
patent: 5324679 (1994-06-01), Kim et al.
patent: 5330584 (1994-07-01), Saga et al.
patent: 5344517 (1994-09-01), Houlding
patent: 5352530 (1994-10-01), Tanuma et al.
patent: 5367217 (1994-11-01), Norling
patent: 5389158 (1995-02-01), Fraas et al.
patent: 5391236 (1995-02-01), Krut et al.
patent: 5447576 (1995-09-01), Willis
patent: 5461002 (1995-10-01), Safir
patent: 5466302 (1995-11-01), Carey et al.
patent: 5470761 (1995-11-01), McKee et al.
patent: 5474620 (1995-12-01), Nath et al.
patent: 5478402 (1995-12-01), Hanoka
patent: 5494832 (1996-02-01), Lehmann et al.
patent: 5538563 (1996-07-01), Finkl
patent: 5538902 (1996-07-01), Izu et al.
patent: 5567248 (1996-10-01), Chung
patent: 5567656 (1996-10-01), Chun
patent: 5609694 (1997-03-01), Asai
patent: 5641381 (1997-06-01), Bailey et al.
patent: 5733382 (1998-03-01), Hanoka
patent: 5773791 (1998-06-01), Kuykendal
patent: 5851928 (1998-12-01), Cripe et al.
patent: 5852322 (1998-12-01), Speckbacher
patent: 5895530 (1999-04-01), Shrotriya et al.
patent: 5902120 (1999-05-01), Igel et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 5904548 (1999-05-01), Orcutt et al.
patent: 5930644 (1999-07-01), Tsai et al.
patent: 5972732 (1999-10-01), Gee et al.
patent: 5985742 (1999-11-01), Henley et al.
patent: 5994641 (1999-11-01), Kardauskas
patent: 5997713 (1999-12-01), Beetz et al.
patent: 6005276 (1999-12-01), Forrest et al.
patent: 6008449 (1999-12-01), Cole
patent: 6066516 (2000-05-01), Miyasaka et al.
patent: 6074514 (2000-06-01), Bjorkman et al.
patent: 6091021 (2000-07-01), Ruby et al.
patent: 6107161 (2000-08-01), Kitaguro et al.
patent: 6110793 (2000-08-01), Lee et al.
patent: 6126311 (2000-10-01), Schuh
patent: 6127623 (2000-10-01), Nakamura et al.
patent: 6127714 (2000-10-01), Mochizuki
patent: 6130380 (2000-10-01), Nakamura
patent: 6140603 (2000-10-01), Hwang et al.
patent: 6143976 (2000-11-01), Endrōs
patent: 6156620 (2000-12-01), Puchner et al.
patent: 6156967 (2000-12-01), Ralph et al.
patent: 6156968 (2000-12-01), Nishimoto et al.
patent: 6162658 (2000-12-01), Green et al.
patent: 6166318 (2000-12-01), Freeouf
patent: 6168968 (2001-01-01), Umemoto et al.
patent: 6172297 (2001-01-01), Hezel et al.
patent: 6180869 (2001-01-01), Meier et al.
patent: 6184457 (2001-02-01), Tsuzuki et al.
patent: 6262358 (2001-07-01), Kamimura et al.
patent: 6265653 (2001-07-01), Haigh et al.
patent: 6265741 (2001-07-01), Schrems
patent: 6294723 (2001-09-01), Uematsu et al.
patent: 6316281 (2001-11-01), Lee et al.
patent: 6320115 (2001-11-01), Kataoka et al.
patent: 6320116 (2001-11-01), Hanoka
patent: 6323415 (2001-11-01), Uematsu et al.
patent: 6406979 (2002-06-01), Fischer et al.
patent: 6407327 (2002-06-01), Ralph et al.
patent: 6407329 (2002-06-01), Lino et al.
patent: 6410843 (2002-06-01), Kishi et al.
patent: 6455873 (2002-09-01), Lonergan
patent: 6479744 (2002-11-01), Tsuzuki et al.
patent: 6492704 (2002-12-01), Coroy
patent: 6515217 (2003-02-01), Aylaian
patent: 6515218 (2003-02-01), Shimizu et al.
patent: 6525374 (2003-02-01), Sittig et al.
patent: 6553729 (2003-04-01), Nath et al.
patent: 6583032 (2003-06-01), Ishikawa et al.
patent: 6846984 (2005-01-01), Fath et al.
patent: 2001/0013630 (2001-08-01), Cho et al.
patent: 2002/0119290 (2002-08-01), Park et al.
patent: 2004/0097012 (2004-05-01), Weber et al.
patent: 2004/0119067 (2004-06-01), Weeks et al.
patent: 2005/0272225 (2005-12-01), Weber et al.
patent: 3803769 (1989-08-01), None
patent: 19650111 (1998-06-01), None
patent: 19907506 (1999-09-01), None
patent: 0 083 510 (1983-07-01), None
patent: 0 718 873 (1996-06-01), None
patent: 0 991 129 (2000-04-01), None
patent: 1 182 710 (2002-02-01), None
patent: 1 383 165 (1975-02-01), None
patent: S53-073075 (1978-06-01), None
patent: 58010873 (1983-01-01), None
patent: 59059883 (1984-04-01), None
patent: S59-123279 (1984-07-01), None
patent: S59-123283 (1984-07-01), None
patent: S61-108176 (1986-05-01), None
patent: S62-054927 (1987-03-01), None
patent: 63295500 (1988-12-01), None
patent: 3-6824 (1991-01-01), None
patent: 3-276682 (1991-12-01), None
patent: 6-55733 (1994-03-01), None
patent: H06-213554 (1994-08-01), None
patent: 07188947 (1995-07-01), None
patent: 7-302890 (1995-11-01), None
patent: 8274371 (1996-10-01), None
patent: 09-219531 (1997-08-01), None
patent: 10193338 (1998-07-01), None
patent: 11074234 (1999-03-01), None
patent: AH11-068131 (1999-03-01), None
patent: 11090923 (1999-04-01), None
patent: 11163284 (1999-06-01), None
patent: H11-236689 (1999-08-01), None
patent: 11-312815 (1999-11-01), None
patent: 11-312816 (1999-11-01), None
patent: 2000-36609 (2000-02-01), None
patent: 2000-101111 (2000-04-01), None
patent: 2000-261008 (2000-09-01), None
patent: A2000-277763 (2000-10-01), None
patent: A2001-257371 (2001-09-01), None
patent: 2001-332529 (2001-11-01), None
patent: 2002-217439 (2002-08-01), None
patent: 98/09318 (1998-03-01), None
patent: 98/24119 (1998-06-01), None
patent: 98/25312 (1998-06-01), None
patent: 98/32164 (1998-07-01), None
patent: WO 00/28602 (2000-05-01), None
patent: 00/62348 (2000-10-01), None
patent: 00/73090 (2000-12-01), None
patent: WO 02/45143 (2002-06-01), None
patent: WO 03/047004 (2003-06-01), None
Chien, F. S-S. et al., “Nanometer-scale conversion of Si3N4 to SiOx,” Applied Physics Letters, Jan. 17, 2000, AIP, American Institute of Physics, Melville, NY, US, 76(3), 360-362.
Derwent Abstract Accession No. 89-019632/03, JP 63-295500 A (Shinetsu Chemical Industries KK), Dec. 1, 1988, 1 page.
Derwent Abstract Accession No. 97-005065/01, JP 8-274371 A (Toyoda Gosei KK), Oct. 18, 1996, 3 pages.
Derwent Abstract Accession No. 98-461330/40, JP

Affiliated with

Also associated with

Rating

Semiconductor texturing process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor texturing process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor texturing process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4169684