Semiconductor system-in-package and method for making the same

Details Semiconductor system-in-package and method for making the same Semiconductor system-in-package and method for making the same

2011-06-14

2011-06-14

Lee, Eugene (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S686000, C257S690000, C257S692000, C257S723000, C257S724000, C257S777000, C257SE23039, C257SE23070, C257SE23071, C257SE23078, C257SE21502, C438S109000, C438S611000

Reexamination Certificate

active

07960211

ABSTRACT:
Semiconductor devices that contain a system in package and methods for making such packages are described. The semiconductor device with a system in package (SIP) contains a first IC die, passive components, and discrete devices that are contained in a lower level of the package. The SIP also contains a second IC die that is vertically separated from the first IC die by an array of metal interposers, thereby isolating the components of the first IC die from the components of the second IC die. Such a configuration provides more functionality within a single semiconductor package while also reducing or eliminating local heating in the package. Other embodiments are also described.

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