Semiconductor switching device with leakage current...

Miscellaneous active electrical nonlinear devices – circuits – and – Gating – Utilizing three or more electrode solid-state device

Reexamination Certificate

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Details

C327S434000, C327S050000, C323S283000

Reexamination Certificate

active

06313690

ABSTRACT:

CROSS REFERENCE TO RELATED APPLICATIONS
The subject application claims benefit of the earlier filing dates of Japanese Patent Application Nos.Hei 11-74259 and 2000-32364 filed on Feb. 14, 1999 and Feb. 9, 2000 under the Paris Convention, the entire contents of which are incorporated by reference herein.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor switching device provided with a weak-current detecting function.
2. Description of the Related Art
It may be shown as a conventional semiconductor switching device with a current detection function in FIG.
1
. This switching device is installed between a power
101
and a load
102
. This device has the structure which connected a shunt resistor RS with the switching device which consists of power FETs, etc. in series. Usual the shunt resistor and the switching device are included in the identical substrate. The current detection is carried out using the potential difference which arises in shunt resistor double end. The potential difference arises in the double end of shunt resistor RS, when load current flows. This potential difference is amplified in a differential amplifier
911
and a direct current amplifier
913
. The amplified potential difference by going through an A/D converter
902
, it is read in the microcomputer, and the microcomputer judges overcurrents and less currents, etc., Negligible currents such as the leakage current can be also detected in theory by this method. Since the value of the detection current is small, it becomes a problem that the detection sensitivity is raised. In the reason, the countermeasure of raising the amplification factor of the direct current amplifier
913
and the differential amplifier
911
and of raising the value of the shunt resistor is required. It becomes a problem that the exothermic reaction of the shunt resistor as a load current flowed increases, when the shunt resistor is increased. In addition, there is a problem that the voltage supplied for the load lowers, when the voltage drop which arises in the shunt resistor increases. In the meantime, there is a problem that the detection accuracy becomes bad, since an S/N ratio deteriorates, when an amplification factor of the differential amplifier
911
and direct current amplifier
913
is raised. In method using this shunt resistor, when the value of detecting negligible current decreases, this problem becomes difficult and the accomplishing goal becomes difficult.
An original function of the semiconductor switching device is to supply the electric power from the power source
101
in the load
102
. Except for it, it has the function, namely the overcurrent protection function, when the trouble in which the wiring between the load
102
and the shunt resistor RS touched ground arose, which prevents that a large current flows for the wiring with the shunt resistor. It has the function which prevents that large current flows for the wiring with the shunt resistor. This overcurrent protection function becomes a essential, when the leakage current from the power line is measured using the shunt resistor. There is a case in which the semiconductor switching device contains heating and cutting off function. The semiconductor switching device contains a power element (main FET) QM, a resistor RG, a temperature sensor
121
, a latch
122
and an overheat breaking element FETQS, as it is shown in FIG.
2
. It has heating and cutting off function which compulsorily turns off temperature sensor built-in FETQF by containing gate interception circuit, when the junction temperature of FETQF rises until exceeding the regulation value. Namely, if the temperature sensor
121
detects that the temperature of the power element QM increases above the predetermined value, the latch
122
holds the increased temperature information to turn on the breaking element QS, which forcibly turns off the power element QM. The temperature sensor
121
consists of four diodes that are connected in series, are made of, for example, polysilicon, and are integrated in the vicinity of the power element QM. As the temperature of the power element QM increases, a forward voltage-drop of the four diodes of the temperature sensor
121
decreases. The gate potential of an FET Q
51
drops to low, the FET Q
51
changes from ON to OFF. This pulls up the gate potential of an FET Q
54
to the potential of a gate control terminal G of the element QF, to change the FET Q
54
from OFF to ON. As a result, the latch
122
latches “1” to provide an output of high. This output changes the breaking elements QS from OFF to ON to short-circuit the true gate TG and source S of the power element QM. Consequently, the power element QM changes from ON to OFF. Namely, the power element QM is turned off.
In
FIG. 1
, a zener diode ZD
1
keeps a voltage of 12 V between the gate terminal G and source terminal S of the element QF and serves as a bypass for an overvoltage so that the overvoltage may avoid the true gate TG of the power element QM. The driver
901
has differential amplifiers
911
and
913
serving as a current monitor circuit, a differential amplifier
912
serving as a current limit circuit, a charge pump
915
, and a driver
914
. According to an ON/OFF control signal from the microcomputer
903
and an overcurrent signal from the current limit circuit, the driver
914
drives the true gate TG of the element QF. If an overcurrent exceeding an upper limit is detected through the differential amplifier
912
due to a voltage drop at the shunt resistor RS, the driver
914
makes the element QF nonconductive. If the current again decreases below the upper limit, the driver
914
makes the element QF conductive. On the other hand, the microcomputer
903
always monitors a current through the current monitor circuit made of the differential amplifiers
911
and
913
, and if detects an abnormal current exceeding a normal value, makes the driver
914
turn off the element QF. If the temperature of the element QF exceeds a predetermined value before the microcomputer
903
issues an OFF instruction to the driver
914
, the overheat breaking function mentioned above turns off the element QF.
The prior art must employ the shunt resistor RS connected to a power line in series, to detect a current in the power line. When a current supplied from a power source to a load through the power line is large, the shunt resistor RS causes a large heat loss that is unignorable.
To detect a weak current in the power line, the resistance value of the shunt resistor RS must be large. This, however, produces a large amount of heat when a large current is passed through the power line. To avoid this, the resistance value of the shunt resistor RS must be decreased, and then, it becomes difficult to detect a weak current in the power line.
The prior art detects a current in the power line according to a voltage drop at the shunt resistor RS. To achieve this, the prior art must have a current monitor circuit involving the shunt resistor RS, A/D converter
902
, microcomputer
903
, etc. These parts need a large space and are expensive, thereby increasing the size and cost of the switching device.
Even if the load controlled by the switching device is OFF, a leak current will flow if the power line between the load and the power source causes a grounding fault or a short circuit due to, for example, abrasion, moisture, or corrosion. If no measures are taken, the leak current will increase to cause a fire. It is strongly required, therefore, to monitor a weak leak current while the load is OFF.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a semiconductor switching device having a weak-current detecting function, capable of detecting a weak leak current in a power line without a shunt resistor connected in series to the power line. This switching device minimizes a heat loss, is easy to integrate, and is manufacturable at low cost.
In order to accomplish the object, the present invention provides an apparatus for det

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