Semiconductor substrate with SOI structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including high voltage or high power devices isolated from...

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257501, 257507, 257509, 257347, H01L 2701, H01L 2712, H01L 2900

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active

058442944

ABSTRACT:
A semiconductor substrate which is optimum for a substrate for integrating a vertical power element and a control circuit element monolithically. A cavity 3 is formed between a dielectric layer 2 and a single crystal silicon substrate 4 in a control circuit element forming region 8, and junction planes 1a and 4a of single crystal silicon substrates 1 and 4 are joined together. Since bonding of regions where a vertical power element is formed is made with flat single crystal silicon planes, no void (non-bonded portion) is generated on the junction plane of the region where the vertical power element is formed. As a result, it is possible to realize a semiconductor device provided with perfect junction having electrical conductivity in a direction perpendicular to the junction interface.

REFERENCES:
patent: 4908328 (1990-03-01), Hu et al.
patent: 4963505 (1990-10-01), Fuji et al.
patent: 5444289 (1995-08-01), Cambou et al.

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