Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2009-01-23
2011-11-22
Ahmadi, Mohsen (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S009000, C438S311000, C438S474000, C438S475000, C257SE21088, C257SE21122, C257SE21218, C257SE21567
Reexamination Certificate
active
08062957
ABSTRACT:
The invention relates to a method for preparing a surface of a semiconductor substrate by oxidizing the surface of the semiconductor substrate to thereby transform the natural oxide into an artificial oxide and then removing the artificial oxide, in particular to obtain an oxide-free substrate surface.
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Ahmadi Mohsen
S.O.I.Tec Silicon on Insulator Technologies
Winston & Strawn LLP
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