Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-04-06
2000-10-03
Graybill, David E.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257703, 257746, 257748, 257779, H01L 2348, H01L 2306, H01L 2940
Patent
active
061277274
ABSTRACT:
A composite conductor for contacting a semiconductor device chip. A durable substrate subassembly for a high power transistor switching modules. The substrate subassembly is durable because wire bonds to the semiconductor device electrodes are replaced with a soldered metal/ceramic composite conductor. The part of the composite conductor contacting the semiconductor device has a coefficient of thermal expansion close to that of the semiconductor device. The substrate in the substrate subassembly has automatic alignment features. The composite conductor also has automatic alignment features, along with stress relief features. Automatic alignment permits concurrent soldering of the chip to the substrate, and the composite conductor to the chip and to a terminal contact.
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Delco Electronics Corp.
Funke Jimmy L.
Graybill David E.
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