Data processing: measuring – calibrating – or testing – Measurement system – Orientation or position
Reexamination Certificate
2011-08-09
2011-08-09
Bhat, Aditya (Department: 2857)
Data processing: measuring, calibrating, or testing
Measurement system
Orientation or position
Reexamination Certificate
active
07996178
ABSTRACT:
A semiconductor substrate processing apparatus and a method for processing semiconductor substrates are provided. The method may include providing a semiconductor substrate having a surface and a plurality of features on the surface, each feature being positioned on the surface at a first respective point in a first coordinate system, plotting the position of each feature at a second respective point in a second coordinate system; and generating a translation between the first and the second coordinate systems. The generating of the translation may include calculating an offset between the first and the second coordinate systems. The calculating of the offset may include calculating an offset distance between a reference point of the first coordinate system and a reference point of the second coordinate system and calculating an offset angle between an axis of the first coordinate system and an axis of the second coordinate system.
REFERENCES:
patent: 5805866 (1998-09-01), Magome et al.
patent: 5806866 (1998-09-01), Fleischer
patent: 5808910 (1998-09-01), Irie et al.
patent: 6281024 (2001-08-01), Yoshitake et al.
patent: 6876946 (2005-04-01), Yasuda et al.
patent: 7330261 (2008-02-01), Van Haren et al.
patent: 7388213 (2008-06-01), Sullivan
patent: 2003/0045131 (2003-03-01), Verbeke et al.
patent: 2004/0258514 (2004-12-01), Raaijmakers
patent: 08 008175 (1996-06-01), None
patent: 08008175 (1996-06-01), None
patent: WO98/44330 (1998-10-01), None
patent: WO00/26646 (2000-05-01), None
patent: WO02/088683 (2002-11-01), None
patent: PCT/US2005/042863 (2005-11-01), None
patent: WO2006/088527 (2006-08-01), None
Non-Final Office Action from U.S. Appl. No. 11/040,329, mailed Jun. 10, 2009, 12 pgs.
Notice of Grounds for Rejection from Korean Patent Application No. 2007-7018933 mailed Mar. 30, 2009, 12 pgs.
Extended Search Report from EP07019258.8-2222 / 1876634 mailed Nov. 10, 2009, 7 pgs.
Written Report of Re-Examination from Korean Patent Application No. 2007-7018933 mailed Jan. 22, 2010, 2 pgs.
Notice of Ruling on Re-Examination from Korean Patent Application No. 2007-7018933 mailed Jan. 25, 2010, 1 pg.
Notice of Final Rejection from Korean Patent Application No. 2007-7018933 mailed Nov. 5, 2009, 2 pgs.
Examination Report from EP07019258.8-2222 / 1876634 mailed Mar. 22, 2010, 1 pg.
PCT Search Report PCT Application PCT/US2005/042863, mailed Nov. 8, 2005, 14 pgs.
International Preliminary Report on Patentability from PCT/US2005/042863 mailed Aug. 2, 2007, 7 pgs.
Non-Final Office Action from U.S. Appl. No. 11/040,329 mailed Dec. 10, 2008, 14 pgs.
Examination Report from European Application No. EP 05 847 786.0-2222 mailed Aug. 12, 2010, 4 pgs.
Bhat Aditya
Blakely , Sokoloff, Taylor & Zafman LLP
Revera Incorporated
LandOfFree
Semiconductor substrate processing method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor substrate processing method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor substrate processing method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2737744