Semiconductor substrate processing apparatus

Details Semiconductor substrate processing apparatus Semiconductor substrate processing apparatus

2006-05-23

2006-05-23

Fiorilla, Chris (Department: 1734)

Coating apparatus

Work holders, or handling devices

Combined with drip pans or surplus collection

C118S052000, C118S612000, C134S103100, C134S902000, C134S198000

Reexamination Certificate

active

07048800

ABSTRACT:
According to one aspect of the invention, a semiconductor substrate, or wafer, processing apparatus is provided. The wafer processing apparatus may include a frame, a semiconductor substrate support, a dispense head connected to the frame to dispense a semiconductor processing fluid onto a substrate on the support, and a catch cup, having a top section and a mid-section, connected to the frame around the wafer support. A portion of an inner surface of the top section may not face towards, or face away from, a central axis of the semiconductor substrate. An upper surface of the mid-section may have substantially no horizontal portions.

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patent: 2003/0183250 (2003-10-01), Chiu et al.
patent: RS 111749 (2004-10-01), None

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