Semiconductor substrate having wiring conductors at a first main

Details Semiconductor substrate having wiring conductors at a first main Semiconductor substrate having wiring conductors at a first main

1992-12-14

1996-01-16

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257697, 257713, 257723, 257777, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054850398

ABSTRACT:
A semiconductor device includes a semiconductor substrate having a pair of opposed main surfaces with a wiring conductor provided on one of the main surfaces; the substrate having at least one through hole extending therethrough so as to be perpendicular to the main surfaces; at least one electrically conductive pin provided on the other of the main surfaces at a position of the at least one through hole, and an adhesive filled into the at least one through hole for fixing the at least one conductive pin to the substrate, wherein the at least one conductive pin is connected electrically through the corresponding at least one through hole to the wiring conductor to transmit/receive an electrical signal to/from an external circuit.

REFERENCES:
patent: 4021838 (1977-05-01), Warwick
patent: 4074342 (1978-02-01), Honn et al.
patent: 4338621 (1982-07-01), Braun
patent: 4561006 (1985-12-01), Currie
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4866841 (1989-09-01), Hubbard
patent: 4893174 (1990-01-01), Yamada et al.
patent: 4953060 (1990-08-01), Lauffer et al.
patent: 5006922 (1991-04-01), McShane et al.
patent: 5016087 (1991-05-01), Haug et al.
patent: 5025347 (1991-06-01), Shindo et al.
patent: 5266912 (1993-11-01), Kledzik
Proceedings of International Conference on Wafer Scale Integration, Jan. 1989, pp. 55-64.

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