Metal working – Method of mechanical manufacture – Fluid pattern dispersing device making – e.g. – ink jet
Reexamination Certificate
2006-06-06
2006-06-06
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Fluid pattern dispersing device making, e.g., ink jet
C347S054000, C347S058000, C347S061000, C438S021000
Reexamination Certificate
active
07055242
ABSTRACT:
A semiconductor substrate includes electronic circuitry and has a machined feature formed therein. The semiconductor substrate is formed by a process which includes providing the semiconductor substrate having the electronic circuitry formed therein, and performing a machining process on the substrate to form the machined feature therein. The machined feature includes a slot and the machining process forms cracks at ends of the slot that reduce a fracture strength of the substrate. Removing portions of the semiconductor substrate proximate the cracks such that end points of the cracks have a curved terminus as formed by the removed portions improves the fracture strength of the substrate.
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Bresciani Martin
Ramos David O.
Hewlett--Packard Development Company, L.P.
Tugbang A. Dexter
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