Semiconductor substrate etching apparatus

Details Semiconductor substrate etching apparatus Semiconductor substrate etching apparatus

1991-09-12

1993-01-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156662, 156626, 29 2501, H01L 21306, B44C 122

Patent

active

051767830

ABSTRACT:
A semiconductor substrate etching apparatus for etching a tapered outer circumferential surface of a semiconductor substrate. A semiconductor substrate supply unit, an X-Y stage unit, an etchant applying unit, a cleaning unit, a baking unit, and a semiconductor substrate recovering unit are arranged in a horizontal plane in the described order. Semiconductor substrates are sequentially transferred by a transfer mechanism from the semiconductor substrate supply unit to the semiconductor substrate recovering unit in the described order. A control unit controls the transfer mechanism to perform the transferring of the semiconductor substrate, and controls the X-Y stage unit in response to a position detection signal, outputted from a position detector, for positioning the semiconductor substrate on the X-Y stage unit.

REFERENCES:
patent: 4968375 (1990-11-01), Sato et al.

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