Semiconductor substrate conditioning head having a plurality of

Details Semiconductor substrate conditioning head having a plurality of Semiconductor substrate conditioning head having a plurality of

1994-07-27

1996-07-16

Kisliuk, Bruce M.

Abrading

Machine

Rotary tool

451526, 451287, 451 36, B24B 500, B24B 2900

Patent

active

055362028

ABSTRACT:
A pad conditioning method and apparatus for chemical-mechanical polishing. A polishing pad (114) is attached to a platen (112) and used to polish a wafer (116). Rotating arm (118) positions the wafer (116) over the pad (114) and applies pressure. During wafer polishing particles build up on the polishing pad (114) reducing its effectiveness. Either during or in between wafer polishing (or both), conditioning head (122) is applied to pad (114) to remove the particles from pad (114) into the slurry (120). Conditioning head (122) comprises a semiconductor substrate (126) that is patterned and etched to form a plurality of geometries (128) having a feature size on the order of polishing pad (114) cell size.

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patent: 5216843 (1993-06-01), Brievogel et al.
patent: 5222329 (1993-06-01), Yu
patent: 5294814 (1994-03-01), Das
patent: 5329734 (1994-07-01), Yu
patent: 5332467 (1994-07-01), Sune et al.

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