Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2011-03-01
2011-03-01
Webb, Gregory E (Department: 1761)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S003000, C510S175000
Reexamination Certificate
active
07896970
ABSTRACT:
A semiconductor substrate cleaning liquid composition is provided that includes one or more types selected from the group consisting of a compound having at least two sulfonic acid groups per molecule, phytic acid, and a condensed phosphoric acid compound; an inorganic acid; and water. There is also provided a process for cleaning a semiconductor substrate that includes a first step of cleaning the semiconductor substrate using the semiconductor substrate cleaning liquid composition and, subsequent to the first step, a second step of cleaning the semiconductor substrate with pure water, ozone water formed by dissolving ozone gas in pure water, or aqueous hydrogen peroxide.
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Abe Yumiko
Ishikawa Norio
Tomita Hiroshi
Yamada Hiroaki
Yamada Yuji
Corless Peter F.
DiCeglie Nicholas J.
Edwards Angell Palmer & & Dodge LLP
Kabushiki Kaisha Toshiba
Kanto Kagaku Labushiki Kaisha
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