Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2011-07-12
2011-07-12
Fahmy, Wael M (Department: 2814)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C438S534000, C257S077000, C257SE21064
Reexamination Certificate
active
07977210
ABSTRACT:
A semiconductor substrate includes a silicon carbide substrate having a first impurity concentration, a first silicon carbide layer formed on the silicon carbide substrate and having a second impurity concentration, and a second silicon carbide layer of a first conductivity type formed on the first silicon carbide layer and having a third impurity concentration, wherein the second impurity concentration is higher the an either the first impurity concentration or the third impurity concentration.
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Nishio Johji
Ota Chiharu
Shinohe Takashi
Fahmy Wael M
Ingham John C
Kabushiki Kaisha Toshiba
Ohlandt Greeley Ruggiero & Perle L.L.P.
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