Semiconductor substrate and method of connecting...

Details Semiconductor substrate and method of connecting... Semiconductor substrate and method of connecting...

2011-01-11

2011-01-11

Doan, Theresa T (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S700000, C257S706000, C438S106000

Reexamination Certificate

active

07868449

ABSTRACT:
A semiconductor substrate includes a substrate layer and a circuit film formed over the substrate layer. One or more openings are formed in the circuit film and the substrate layer. Conductive plates are formed over the circuit film at the peripheries of the openings. A semiconductor die is attached to the circuit film, below the openings with an adhesive material. A conductive material is disposed in the openings to electrically connect the semiconductor die to the conductive plates.

REFERENCES:
patent: 6400573 (2002-06-01), Mowatt et al.
patent: 6975037 (2005-12-01), Farnworth et al.
patent: 7485489 (2009-02-01), Bjorbell
patent: 2006/0170098 (2006-08-01), Hsu
patent: 2008/0099911 (2008-05-01), Machida

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