Semiconductor structures having multiple conductive layers...

Details Semiconductor structures having multiple conductive layers... Semiconductor structures having multiple conductive layers...

2006-02-21

2006-02-21

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C438S459000, C438S738000, C438S977000

Reexamination Certificate

active

07001825

ABSTRACT:
In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and a plurality of conductive layers in the opening. In some embodiments, one conductive layer provides an electromagnetic shield that shields the substrate from AC signals carried by a contact pad made from another conductive layer on a backside of the substrate. The conductive layers can also be used to form capacitor/rectifier networks. Manufacturing methods also provided.

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