Semiconductor structures for gallium nitride-based devices

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S018000, C257S190000, C257S449000, C257SE33034

Reexamination Certificate

active

07115896

ABSTRACT:
A nitride semiconductor is grown on a silicon substrate by depositing a few mono-layers of aluminum to protect the silicon substrate from ammonia used during the growth process, and then forming a nucleation layer from aluminum nitride and a buffer structure including multiple superlattices of AlRGa(1-R)N semiconductors having different compositions and an intermediate layer of GaN or other Ga-rich nitride semiconductor. The resulting structure has superior crystal quality. The silicon substrate used in epitaxial growth is removed before completion of the device so as to provide superior electrical properties in devices such as high-electron mobility transistors.

REFERENCES:
patent: 5158909 (1992-10-01), Ohtsuka et al.
patent: 5602418 (1997-02-01), Imai et al.
patent: 5622877 (1997-04-01), Ashkinazi et al.
patent: 5877558 (1999-03-01), Nakamura et al.
patent: 5956578 (1999-09-01), Weitzel et al.
patent: 6110277 (2000-08-01), Braun
patent: 6255198 (2001-07-01), Linthicum et al.
patent: 6323053 (2001-11-01), Nishikawa et al.
patent: 6437374 (2002-08-01), Northrup et al.
patent: 6507041 (2003-01-01), Nakamura et al.
patent: 6515306 (2003-02-01), Kuo et al.
patent: 6524900 (2003-02-01), Dahlqvist et al.
patent: 6576973 (2003-06-01), Collard et al.
patent: 6586777 (2003-07-01), Yuasa et al.
patent: 6586781 (2003-07-01), Wu et al.
patent: 6602764 (2003-08-01), Linthicum et al.
patent: 6608327 (2003-08-01), Davis et al.
patent: 6610995 (2003-08-01), Nakamura et al.
patent: 6617060 (2003-09-01), Weeks et al.
patent: 2003/0015708 (2003-01-01), Parikh et al.
patent: 2003/0062525 (2003-04-01), Parikh et al.
patent: 2003/0075728 (2003-04-01), Tool et al.
patent: 2004/0195562 (2004-10-01), Munns
patent: 4210402 (1992-10-01), None
patent: 0 380 340 (1992-04-01), None
patent: WO 02/48434 (2002-06-01), None
Yanagihara, et al., “Development of GaN-Based Electronic Device on Si”, Sanken Technical Report, vol. 35, No. 1 (2003), pp. 11-14, Japan (English—language translation of Japanese—language publication).
Brown, et al., “AlGaN/GaN HFETs Fabricated on 100-mm GaN on Silicon (111) Substrates,” Solid-State Electronics, vol. 46, pp. 1535-1539 (2002).
Feltin, et al., “Stress Control in GaN Grown on Silicon (111) by Metalorganic Vapor Phase Epitaxy,” Applied Physics Letters, vol. 79, No. 20, pp. 3230-3232 (Nov. 12, 2001).
Marchand, et al., “Metalorganic Chemical Vapor Deposition of GaN on Si (111): Stress Control and Application to Field-Effect Transistors,” Journal of Applied Physics, vol. 89, No. 12, pp. 7846-7851 (Jun. 15, 2001).
Armitage, et al., “Lattice-Matched HfN Buffer Layers for Epitaxy of GaN on Si,” Applied Physics Letters, vol. 81, No. 8, pp. 1450-1452 (Aug. 15, 2002).
Manohar, et al., “Characteristics of Microwave Power GaN HEMTs on 4-inch Si Wafers,” 2002 IEEE International Microwave Symposium, Seattle WA.
Kalisch, et al., “Growth and Characterisation of AlGaN/GaN HEMT on Silicon Substrates”.
Dadgar, et al., “MOVCD Grown AlGaN/GaN FETs on Si(111)”.
Poschenrieder, et al., “Bright Blue to Orange Photoluminescence Emission from High-Quality InGaN/GaN Multiple-Quantum-Wells on Si(111) Substrates,” Applied Physics Letters, vol. 81, No. 9, pp. 1591-1593 (Aug. 26, 2002).
Jang, et al., “Characteristics of GaN/Si(111) Epitaxy Grown Using Al0.1Ga0.9N/AIN Composite Nucleation Layers Having Different Thicknesses of AIN,” Journal of Crystal Growth, vol. 241, pp. 289-296 (2002).
Wan, et al., “Growth of Crack-Free Hexagonal GaN Films on Si(100),” Applied Physics Letters, vol. 79, No. 10, pp. 1459-1461 (Sep. 3, 2001).
Tran, et al., “Growth of InGaN/GaN Multiple-Quantum-Well Blue Light-Emitting Diodes on Silicon by Metalorganic Vapor Phase Epitaxy,” Applied Physics Letters, vol. 75, No. 11, pp. 1494-1496 (Sep. 13, 1999).
Dadgar, et al., “Thick, Crack-Free Blue Light-Emitting Diodes on Si(111) Using Low-Temperature AIN Interlayers andIn SituSixNyMasking,” Applied Physics Letters, vol. 80, No. 20, pp. 3670-3672 (May 20, 2002).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor structures for gallium nitride-based devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor structures for gallium nitride-based devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor structures for gallium nitride-based devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3628399

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.